SIMCOM SIM8300 5G

SIMCOM SIM8300 5G Specification

Chipset

Qualcomm Snapdragon X55 Modem

Form factor/package

LGA

Network technology

Sub-6G/mmWave/LTE-FDD/LTE-TDD/WCDMA

Support 4G LTE FDD Band

B1/B2/B3/B4/B5/B7/B8/B12/B13/B14/B17/B18/B19/B20/B25/B26/B28/B29/B30/B32/B66/B71

Support 4G LTE TDD Band

B34/B38/B39/B40/B41/B42/B43/B48

Support 3G WCDMA Band

B1/B2/B3/B4/B5/B8

Data rates

- Sub‐6G: Downlink up to 4 Gbps, Uplink up to 450Mbps
- LTE CAT22: Downlink up to 2.4Gbps, Uplink up to 200Mbps
- HSPA+: Downlink up to 42.0Mbps, Uplink up to 5.76Mbps

GNSS

GPS/GLONASS/BeiDou/Galileo/QZSS

Supply voltage range

3.3V ~ 4.3V

Operation temperature

‐40℃ ~ +85℃

Dimensions

41.0*43.6*2.8mm

Interfaces

- USB2.0 with High speed up to 480Mbps
- USB3.1 with SS Gen2
- UART
- USIM and E‐SIM interface(1.8V /2.85V)
- Digital Audio through PCM
- I2C
- I2S for Audio
- SPI
- ADC
- GPIOs
- RGMII
- PCIe Gen3
- SDIO3.0
- WIFI
- PMI
- Antenna x 8

Other Features

- USB Driver for Microsoft Windows Win7/Win8/Win10

- USB Driver for Linux /Android

- RIL supporting for Android 5.0/6.0/7.0/8.0

- RNDIS /NDIS/PPP/MBIM to Win8

- Firmware update via USB

- TCP/IP/IPV4/IPV6/Multi‐PDP/FTPS /HTTPS/MQTTS/DNS

- SSL3.0/TLS1.0/TLS1.2

- DTMF (Sending and Receiving)

- VoNR/VoLTE/CSFB

- FOTA/OTA

- AGPS/SUPL2.0

Approvals

- RoHS Compliant

- CCC*

- CTA*

- SRRC*

- REACH*

- CE*

- FCC*

- GCF

- RCM